In the process of semiconductor wafer polishing, the polishing time is short, the polishing speed is required to be fast, the surface quality is good, and the impurity residue is less, so as to avoid affecting the performance and yield of power devices. Silica sol has uniform particle size distribution, more effective particles for grinding and fast polishing rate; Moderate hardness, good dispersion and fluidity, not easy to precipitate and agglomerate, resulting in wafer scratch; At the same time, the silica sol has high purity, low residue and easy cleaning, which reduces the influence of wafer surface contamination.
Product recommendation: HSD-10040, HSD-12040, HSD-8040, HSD-12040A, HSD-14040A, HSD-5040, HS-1430, HS-1430A; It can be customized according to customer requirements